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Room-temperature vulcanizing silicone elastomers from WACKER reliably protect against external influences, which ensures the functional safety of electrical and electronic components. As one of the world’s leading silicone manufacturers with many years of experience, WACKER is a competent partner of the industry and offers tailor-made solutions for potting, bonding, sealing and coating.
Main Properties:
- For applications in closed housings
- Low modulus of elasticity (10 – 100 kPa)
- Damping of thermomechanical stress
- Broad range of application temperatures (-45 to +180 °C)
- Superior reliability
- Low ion levels
- Low bleeding
- Tailor-made processing properties for fast mass production
- Room-temperature or heat curing (one-component)
- Self-leveling and thixotropic gels
- Adhesion to various substrates due to inherent tack
Soft Gel Applications:
- Sensitive electronic components
- ECUs
- Power modules
- Discrete devices (glob tops)
- Sensors
- Displays
- Bonded ICs
Tough Gel Applications:
- Voltage regulators
- Transformer potting
- Coil potting
- Junction boxes for PV applications
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Products
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Technical data
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Product properties
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Viscosity, dynamic | Pot life | Penetration | Regulation | Crosslinking Property | Vulcanizate | ||
ELASTOSIL® CAT UV | 1000 mPa·s[1] 1000 mPa·s[1] | ≥ 1 d[7] ≥ 1 d[7] | - - | - | - | - | |
ELASTOSIL® RT 745 "S" A/B | 1000 mPa·s[2] 1000 mPa·s[2] | - - | - - | - | - | - | |
ELASTOSIL® RT 745 T A/B | 1000 mPa·s[3] 1000 mPa·s[3] | - - | - - | - | - | - | |
ELASTOSIL® RT 745 T A/B KR | 1000 mPa·s[3] 1000 mPa·s[3] | - - | - - | - | - | - | |
ELASTOSIL® RT 745 T A/B KR | 1000 mPa·s[3] 1000 mPa·s[3] | - - | - - | - | - | - | |
SEMICOSIL® 911 A/B | 8000 mPa·s[4] 8000 mPa·s[4] | - - | - - | Low volatile | Two-component, Addition Curing | low ion content | |
SEMICOSIL® 9242 | 20000 mPa·s[5] 20000 mPa·s[5] | - - | - - | - | - | - | |
SEMICOSIL® 950 UV B | 1000 mPa·s[6] 1000 mPa·s[6] | - - | - - | - | - | - | |
WACKER SilGel® 612 A/B | 1000 mPa·s[1] 1000 mPa·s[1] | - - | 300 1/10mm[8] 300 1/10mm[8] | - | - | - | |
WACKER SilGel® 613 | - - | - - | 70 1/10mm[9] 70 1/10mm[9] | - | - | - | |
WACKER SilGel® 616 A/B | 300 mPa·s[1] 300 mPa·s[1] | - - | 280.0 1/10mm[10] 280.0 1/10mm[10] | - | - | - |
[1] Viscosity, dynamic | 25 °C | ISO 3219, [2] Viscosity, dynamic | 23 °C | ISO 3219, [3] Viscosity, dynamic | ISO 3219, [4] Viscosity A [D=0,5 s⁻¹] | 25 °C | DIN EN ISO 3219, [5] Viscosity, D=0.5 1/s | 25 °C | ISO 3219, [6] Viscosity, dynamic | DIN EN ISO 3219 | A: SEMICOSIL® 949 UV A; B: SEMICOSIL® 950 UV B, [7] Pot life | Typical Value for 25°C for which doubling of mix viscosity in static mixing tube is referred to, [not exposed to UV light or ambient light, depending on addition curing silicone grade]; No processing with premix recommended, [8] Penetration | DIN ISO 2137 | 150 g hollow cone, 1 min., [9] Penetration (hollow cone, 9.38 g) | DIN ISO 2137, [10] Penetration | DIN ISO 2137 | 150 g hollow cone, 60 sec., [] Suited, [] Well suited, [] Ideally suited
Benefits:
- Soft gels (encapsulation)
- Low and high temperature grades
- Elastic adhesives
- Efficient mass production processes using fast heat-curing adhesives at moderate temperatures
- Thermally conductive gap fillers, adhesives, pastes and encapsulants (0.5 – 4 W/mK)
- Low-temperature grades allow applications down to -45 °C and high-temperature grades up to +210 °C
Applications:
- Sealing of electronic control units and housings
- Protection of electronic components by potting or encapsulating
- Bonding of hybrid PCBs
- Sealing/bonding of housing components (CIPG, FIPG and preformed gaskets)
- Coating or bonding of individual elements (e.g. MEMS)
- Thermal management solutions such as bonding to heat sinks, encapsulants and gap fillers
Benefits:
- Excellent resistance at temperatures ranging from -50 °C to +180 °C; for special types, from -110 °C +220 °C
- Very good adhesion to a wide variety of substrates
- Excellent weathering and UV resistance
- Outstanding dielectric properties that barely change over a wide temperature and frequency range
- No corrosive components
- Excellent environmental compatibility
- Water-repellent and low moisture absorption
- Excellent vibration damping
- High chemical purity
Applications:
- Coating and encapsulation of sensitive components (measuring instruments, system control)
- Coating of selected areas of a component
- Sealing of sensor elements
- Sealing of housing components
- Sealing of MEMS microphones and speakers
- Corrosion protection, pressure compensation and vibration damping for electromechanical sensor elements
Benefits:
- High reliability – excellent for harsh testing conditions
- Low shrinkage (< 0.1 %, before/after cure)
- Mura-free
- Extremely low modulus (10 kPa – 200 kPa)
- Superior optical reliability/precision (after aging)
- Solutions for all relevant industrial application processes (dam & fill, dispensing, slot-die coating, screen printing, stencil printing)
- Fast processing (UV-active grades)
- Low elastic modulus – better for one glass solution (OGS), wide temperature range
- Low dielectric constant (2.7 – 2.8)
- Easy to rework and cost-saving
- Broad range of processing parameters
- No oxygen inhibition
- No photo-initiators used
Applications:
- Optical bonding/laminating of touchscreens
- Encapsulation of optical and electronic components
- Production of damping elements
- Large-format displays
- Displays inside a vehicle
Main Properties:
- Low-modulus sealing adhesives
- Very good ability to bond
- Flowable to non-sag
- Sealing between cover/lids and housing
- Pronounced damping properties
- Broad temperature range (-45°C to +180°C)
- Damping of thermomechanical stress
- Maximum reliability and long-term performance
- Tailor-made properties for efficient and fast production processes
Applications:
- Electronic components
- FIPG and CIPG applications
- Housing and lids made from PBT, PA and aluminum
- Suitable for automated processes
UV-curing silicones offer UV-induced curing at room temperature thus enabling extremely short cycle times and increased line throughput, resulting in shorter production times and reduced energy costs.
Benefits:
- High dielectric strength
- Reliable dielectric insulation
- Efficient production processes
Applications:
- Power semiconductors
- Generators
- Automotive / e-mobility