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Electronics

Room-temperature vulcanizing silicone elastomers from WACKER reliably protect against external influences, which ensures the functional safety of electrical and electronic components. As one of the world’s leading silicone manufacturers with many years of experience, WACKER is a competent partner of the industry and offers tailor-made solutions for potting, bonding, sealing and coating.

Main Properties:

  • For applications in closed housings
  • Low modulus of elasticity (10 – 100 kPa)
  • Damping of thermomechanical stress
  • Broad range of application temperatures (-45 to +180 °C)
  • Superior reliability
  • Low ion levels
  • Low bleeding
  • Tailor-made processing properties for fast mass production
  • Room-temperature or heat curing (one-component)
  • Self-leveling and thixotropic gels
  • Adhesion to various substrates due to inherent tack

Soft Gel Applications:

  • Sensitive electronic components
  • ECUs
  • Power modules
  • Discrete devices (glob tops)
  • Sensors
  • Displays
  • Bonded ICs

Tough Gel Applications:

  • Voltage regulators
  • Transformer potting
  • Coil potting
  • Junction boxes for PV applications

Benefits:

  • Soft gels (encapsulation)
  • Low and high temperature grades
  • Elastic adhesives
  • Efficient mass production processes using fast heat-curing adhesives at moderate temperatures
  • Thermally conductive gap fillers, adhesives, pastes and encapsulants (0.5 – 4 W/mK)
  • Low-temperature grades allow applications down to -45 °C and high-temperature grades up to +210 °C

Applications:

  • Sealing of electronic control units and housings
  • Protection of electronic components by potting or encapsulating
  • Bonding of hybrid PCBs
  • Sealing/bonding of housing components (CIPG, FIPG and preformed gaskets)
  • Coating or bonding of individual elements (e.g. MEMS)
  • Thermal management solutions such as bonding to heat sinks, encapsulants and gap fillers

Benefits:

  • Excellent resistance at temperatures ranging from -50 °C to +180 °C; for special types, from -110 °C +220 °C
  • Very good adhesion to a wide variety of substrates
  • Excellent weathering and UV resistance
  • Outstanding dielectric properties that barely change over a wide temperature and frequency range
  • No corrosive components
  • Excellent environmental compatibility
  • Water-repellent and low moisture absorption
  • Excellent vibration damping
  • High chemical purity

Applications:

  • Coating and encapsulation of sensitive components (measuring instruments, system control)
  • Coating of selected areas of a component
  • Sealing of sensor elements
  • Sealing of housing components
  • Sealing of MEMS microphones and speakers
  • Corrosion protection, pressure compensation and vibration damping for electromechanical sensor elements

Benefits:

  • High reliability – excellent for harsh testing conditions
  • Low shrinkage (< 0.1 %, before/after cure)
  • Mura-free
  • Extremely low modulus (10 kPa – 200 kPa)
  • Superior optical reliability/precision (after aging)
  • Solutions for all relevant industrial application processes (dam & fill, dispensing, slot-die coating, screen printing, stencil printing)
  • Fast processing (UV-active grades)
  • Low elastic modulus – better for one glass solution (OGS), wide temperature range
  • Low dielectric constant (2.7 – 2.8)
  • Easy to rework and cost-saving
  • Broad range of processing parameters
  • No oxygen inhibition
  • No photo-initiators used

Applications:

  • Optical bonding/laminating of touchscreens
  • Encapsulation of optical and electronic components
  • Production of damping elements
  • Large-format displays
  • Displays inside a vehicle

Main Properties:

  • Low-modulus sealing adhesives
  • Very good ability to bond
  • Flowable to non-sag
  • Sealing between cover/lids and housing
  • Pronounced damping properties
  • Broad temperature range (-45°C to +180°C)
  • Damping of thermomechanical stress
  • Maximum reliability and long-term performance
  • Tailor-made properties for efficient and fast production processes

Applications:

  • Electronic components
  • FIPG and CIPG applications
  • Housing and lids made from PBT, PA and aluminum
  • Suitable for automated processes

UV-curing silicones offer UV-induced curing at room temperature thus enabling extremely short cycle times and increased line throughput, resulting in shorter production times and reduced energy costs.

Benefits:

  • High dielectric strength
  • Reliable dielectric insulation
  • Efficient production processes

Applications:

  • Power semiconductors
  • Generators
  • Automotive / e-mobility