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Wood Processing

Wood Processing

Testing wood adhesives at the WACKER technical center in Burghausen. Here: creep test.

With VINNAPAS® polymer dispersions and GENIOSIL® silane-modified polymers, WACKER offers two technologies for use in formulating modern, high-performance wood adhesives. HDK® pyrogenic silica improves the storage and processing characteristics.

WACKER offers a highly developed range of VINNAPAS® polyvinyl acetate (PVAC) polymer dispersions for wood adhesives from D2 to D4.

VINNAPAS® Polymer Dispersions

WACKER offers a highly developed range of VINNAPAS® polyvinyl acetate (PVAC) polymer dispersions for wood adhesives from D2 to D4. They make ideal solutions for humid and damp areas (e.g. basements and bathrooms) as well as for exterior applications involving direct water contact (e.g. windows). For discoloration-free bonding of sensitive types of wood, we offer VINNAPAS® DPX 271, a water resistant and ultra-low-formaldehyde binder for D3 wood adhesives.

For EPI (emulsion polymer isocyanate) technology, VINNAPAS® vinyl acetate-ethylene (VAE) polymer dispersions are used in the formulation of wood adhesives for water resistance class of JIS K6806.

General Benefits:

  • Excellent for solid wood bonding
  • Excellent water and heat resistance
  • Product range for all water resistance classes (from D2 to D4; can attain the D4 standard with two-component system)
  • High setting speed

Benefits of VINNAPAS® DPX Technology:

  • Ultra-low formaldehyde level of < 5 ppm
  • Discoloration-free

Applications:

Wood-to-wood processing adhesives D2 to D4, e.g. for furniture, wood flooring, veneers, windows and doors.

  • Assembly
  • Edge banding
  • Edge-to-edge gluing
  • Finger jointing
  • Veneer splicing

GENIOSIL® Silane-Modified Polymers (SMP)

GENIOSIL® silane-modified polymers are so versatile they can equally find use in wood adhesives alongside many other adhesive concepts. Wood adhesives formulated with GENIOSIL® SMPs display Shore D strength values, can attain the D4 standard and are yet one component.

Benefits:

  • Isocyanate-, solvent and plasticizer-free
  • Tin-free (possible when using α SMPs)
  • Broad range of flexibility and strength
  • Unique clarity
  • Low viscosity
  • Temperature- and moisture-stable
  • Paintable

Applications:

  • Bonding wood-to-wood
  • Bonding wood-to-metal & further dissimilar materials

HDK® Pyrogenic Silica

HDK® steuert die rheologischen Eigenschaften von Klebstoffen. So können die Fließeigenschaften von Holzleimen, z.B. auf Basis von 1K PU Systemen, gezielt mit hydrophoben HDK® Produkten eingestellt werden. Die dann thixotropierten Systeme lassen sich besser verarbeiten und erleichtern die Anwendung.

Benefits:

  • Anti settling
  • Adjustment of rheology
  • Sag resistance

Applications:

  • Holzleim

产品推荐

表格可上下滚动
个产品
技术数据
Wood-to-Wood Bonding
BET表面 固体含量 粘度 动力粘度 聚合物 玻璃化温度
木材耐黄变
固化特性
GENIOSIL® XB 502 - - - - 1000 mPas 1000 mPas - - Reinforced α-Dimethoxysilane-modified polymer (SMP) for strong bonding Reinforced α-Dimethoxysilane-modified polymer (SMP) for strong bonding - - - -
GENIOSIL® XT 50 - - - - 1000 mPas 1000 mPas - - Reinforced α-Dimethoxysilane-modified polymer (SMP) for transparent 1K waterproofing membranes Reinforced α-Dimethoxysilane-modified polymer (SMP) for transparent 1K waterproofing membranes - - - -
HDK® H13L approx. 110 m²/g[1] approx. 110 m²/g[1] - - - - - - - - - - - -
HDK® H15 approx. 120 m²/g[1] approx. 120 m²/g[1] - - - - - - - - - - - -
HDK® N20 175 - 225 m²/g[2] 175 - 225 m²/g[2] - - - - - - - - - - - -
VINNAPAS® DP 500 - - 48 - 52 % 48 - 52 % - - 30000 - 40000 mPa·s 30000 - 40000 mPa·s - - approx. 33 °C[3] approx. 91.4 °F[3] 极好 极好
VINNAPAS® DP 600 - - 58 - 62 % 58 - 62 % - - 29000 - 41000 mPa·s 29000 - 41000 mPa·s - - approx. 33 °C[3] approx. 91.4 °F[3] 极好 极好
VINNAPAS® DPN 15 - - 51 - 53 % 51 - 53 % - - 12000 - 18000 mPa·s 12000 - 18000 mPa·s - - approx. 28 °C[3] approx. 82.4 °F[3] 中等 极好
VINNAPAS® DPN 16 - - 50 - 54 % 50 - 54 % - - 10000 - 14000 mPa·s 10000 - 14000 mPa·s - - approx. 28 °C[3] approx. 82.4 °F[3] 高 极好
VINNAPAS® DPN 17 - - 47 - 49 % 47 - 49 % - - 9000 - 13000 mPa·s 9000 - 13000 mPa·s - - approx. 28 °C[3] approx. 82.4 °F[3] 中等 极好
VINNAPAS® DPX 271 - - 44 - 48 % 44 - 48 % - - 6000 - 14000 mPa·s 6000 - 14000 mPa·s - - approx. 30 °C[3] approx. 86.0 °F[3] 极好 极好
说明
[1] BET表面 | DIN ISO 9277/ DIN 66132 | of the hydrophobic silica,  [2] BET表面 | DIN ISO 9277/ DIN 66132,  [3] 玻璃化温度 | 专用方法,  [] 适合,  [] 非常适合,  [] 极其适合 

VINNAPAS® vinyl acetate-ethylene (VAE) polymer dispersions show excellent adhesion to PVC and paper films combined with a broad heat resistance range, a wide formulation latitude and processing advantages. They are ideal to wet-laminate decorative PVC and paper film to wooden materials.

Benefits:

  • Excellent adhesion to PVC film for wet lamination
  • High resistance to plasticizers
  • Very good adhesion to difficult substrates
  • Very high setting speed

Applications:

Decorative wet lamination film to chipboards, MDFs and hardboards.

  • PVC sheet to wood lamination
  • Paper sheet to wood lamination
  • HPM (High Pressure Melamine sheet to plywood) lamination

VINNAPAS® vinyl acetate-ethylene (VAE) polymer dispersions are used in the formulation of adhesives for 3D vacuum membrane press lamination, either by themselves or in blends with polyurethane dispersions.

Benefits:

  • Excellent heat resistance and cohesion
  • Very high setting speed
  • High resistance to plasticizers
  • Excellent compatibility with polyurethane dispersions

Applications:

  • Decorative wet lamination to 3-dimensional chipboards, MDFs and hardboards by using vacuum membrane press process.

产品推荐

表格可上下滚动
个产品
技术数据
固体含量 动力粘度 玻璃化温度
VINNAPAS® EP 645 54 - 56 % 54 - 56 % 4000 - 9000 mPa·s 4000 - 9000 mPa·s approx. 5 °C[1] approx. 41.0 °F[1]
说明
[1] 玻璃化温度 | 专用方法,  [] 适合,  [] 非常适合,  [] 极其适合