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Thermal Interface Material (TIM)

WACKER’s ELASTOSIL® and SEMICOSIL® thermally conductive silicone products provide efficient and reliable heat management for numerous applications in automotive, consumer and power electronics. Our silicone-based products are offered in a variety of viscosities, cure speeds and conductivities to meet the requirements of thermal management in electronics for virtually every industry.

Efficient and Reliable Products for Thermal Management.

Wide Product Portfolio in:

  • Adhesives
  • Gap fillers
  • Pastes
  • Encapsulants

Benefits:

  • Excellent thermal conductivity for heat dissipation (0.5 – 4.8 W/mK)
  • Maintains physical property and full performance in extreme temperatures (-45 °C to + 150° C)
  • Superb flow and processing properties for dispensing ease
  • Conforms and adheres to component shape – good wetting properties
  • Low volatile content
  • Firm yet flexible mechanical bond that doesn’t require further fixing

Applications:

  • Electric vehicle batteries
  • Battery management systems (BMS)
  • Power electronics
  • On-board chargers (OBC)
  • Electronic control units (ECUs)
  • Sensors
  • Consumer electronics
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Gap Fillers
Adhesives
Grease / Paste
Encapsulants / Potting
Thermal conductivity (TC) 1.8 – 4.8 W/mK 0.85 – 4.2 W/mK 0.7 – 4.0 W/mK 0.5 – 4.0 W/mK
Curing type Addition Addition / condensation Non-cure Addition
Viscosity Non-flowable Semi-flowable Non-flowable / pasty Flowable
Bond line thickness 50 – 150 µm < 150 µm < 150 µm < 150 µm
Processing Static mixer (2K) Static mixer (2K) Static mixer (2K), screen printing (2K) Static mixer (2K)

Product Recommendations

Table is scrollable
Products
Technical data
Product properties
Viscosity, dynamic Hardness Shore A Hardness Shore 00 Tensile strength Elongation at break Product Rheology Crosslinking Property Vulcanizate
ELASTOSIL® RT 675 A/B 50000 mPa·s[1] 50000 mPa·s[1] 80[7] 80[7] - - 2 N/mm²[9] 2 N/mm²[9] 20 %[10] 20 %[10] Flowable Two-component, Addition Curing Thermally conductive
SEMICOSIL® 961 TC A/B 130000 mPa·s[2] 130000 mPa·s[2] - - 55[11] 55[11] - - - - - - -
SEMICOSIL® 962 TC A/B 150000 mPa·s[3] 150000 mPa·s[3] - - 50[11] 50[11] - - - - - - -
SEMICOSIL® 9671 TC2 A/B 120000 mPa·s[4] 120000 mPa·s[4] - - - - - - - - - - -
SEMICOSIL® 9672 TC 160.000 - 430.000 mPa·s[5] 160.000 - 430.000 mPa·s[5] - - 60 - 70[11] 60 - 70[11] - - - - - - -
SEMICOSIL® 9981 TC 300 Pa.s[6] 300 Pa.s[6] 80[8] 80[8] - - - - - - - - -
Legend
[1] Viscosity, dynamic | 23 °C | ISO 3219,  [2] Viscosity, dynamic Cone-plate-viscosimeter Component A | 23 °C | ISO 3219, D = 10 1/s,  [3] Viscosity, dynamic (Cone-plateviscosimeter) | 23 °C | ISO 3219, D = 10 1/s,  [4] A-Component | 25 °C | 1 1/s | DIN EN ISO 3219,  [5] Viscosity, dynamic | 25 - 25 °C | 10 - 1 1/s | ISO 3219,  [6] Viscosity [D= 0.5 sec⁻¹] | 25 °C | DIN EN ISO 3219,  [7] Hardness Shore A | DIN ISO 48-4,  [8] Hardness Shore A | DIN 53 505 / ISO 868,  [9] Tensile strength | ISO 37 type 1,  [10] Elongation at break | ISO 37 type 1,  [11] Hardness Shore 00 | ASTM D 2240,  [] Suited,  [] Well suited,  [] Ideally suited