DEHESIVE® ADDITIVE R2
DEHESIVE® ADDITIVE R2 is a Silicone additive designed to lower the release force of WACKER DEHESIVE® coating systems. It can be mixed in most of the DEHESIVE® systems. Due to this it can be used on a wide range of different substrates. Even with low coat weight good release properties can be achieved.
特性
DEHESIVE® ADDITIVE R2 will reduce the release force of a coating system by slowly penetrating onto the surface. Release testing with different standard Tesa tapes show reduced release values. Customer should test the release using their adhesive to confirm these results prior to using.
- excellent release stability
- easy handling
- excellent thermal stability
DEHESIVE® ADDITIVE R2的特殊性能
- 不含溶剂
- 助剂
DEHESIVE® ADDITIVE R2 can be added into solvent based and solvent free DEHESIVE® polymer system to be used for coating of several substrates such as paper, film or others to reach ultra low release forces. WACKER recommends that it should be used in a 1-2% level in the coating formulation as a starting point. Actual use level may vary with the specific application.
Processing
Recommended order of addition is to mix first the polymer with the crosslinker, blend well and add slowly the catalyst. Finally add the DEHESIVE® ADDITIVE R2 and mix properly. Blends with solvent free DEHESIVE® systems get typically slightly turbid which will disappear in the coating. For more instructions also see WACKER "DEHESIVE® Mixing instructions"
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