VINNAPAS® 4023 N (KOR)
VINNAPAS® 4023 N (KOR) is a multi-purpose dispersible polymer powder for dry mix mortars, specifically suited for tile adhesives, ETICS and self levelling compounds. It is based on a flexible copolymer of vinylacetate and ethylene and belongs to the product class VINNAPAS® N which means that it has a neutral effect on rheology and provides the basic properties adhesion and flexibility, giving a high degree of formulation freedom. VINNAPAS® 4023 N (KOR) is part of our standard range, offering you the best-in-class solution for a wide variety of applications.
VINNAPAS® 4023 N (KOR) is a multi-purpose dispersible polymer powder for dry mix mortars, specifically suited for tile adhesives, ETICS and self levelling compounds. It is based on a flexible copolymer of vinylacetate and ethylene and belongs to the product class VINNAPAS® N which means that it has a neutral effect on rheology and provides the basic properties adhesion and flexibility, giving a high degree of formulation freedom. VINNAPAS® 4023 N (KOR) is part of our standard range, offering you the best-in-class solution for a wide variety of applications.
Mehr Produkte
Produkte | Technische Daten |
---|---|
Mindesttemperatur Filmbildung | |
VINNAPAS® 4023 N (KOR) | 1 °C[1] 33.8 °F[1] |
VINNAPAS® 4016 N | 4 °C[1] 39.2 °F[1] |
VINNAPAS® 4023 N (GER) | 1 °C[1] 33.8 °F[1] |
VINNAPAS® 4115 N (GER) | 4 °C[1] 39.2 °F[1] |
VINNAPAS® 4121 N | 1 °C[1] 33.8 °F[1] |
VINNAPAS® 4419 E (Scale-up Product) | 4 °C[1] 39.2 °F[1] |
VINNAPAS® 4713 N | 4 °C[1] 39.2 °F[1] |
VINNAPAS® 5005 N | 11 °C[1] 51.8 °F[1] |
VINNAPAS® 5010 N (CTY) | 4 °C[1] 39.2 °F[1] |
VINNAPAS® 5010 N (GER) | 4 °C[1] 39.2 °F[1] |
VINNAPAS® 5010 N (KOR) | 4 °C[1] 39.2 °F[1] |
VINNAPAS® 5028 E (CTY) | 4 °C[1] 39.2 °F[1] |
VINNAPAS® 5710 N (GER) (Scale-up Product) | 4 °C[1] 39.2 °F[1] |
VINNAPAS® 7220 E | 5 °C[1] 41.0 °F[1] |
VINNAPAS® 7410 E | 4 °C[1] 39.2 °F[1] |
VINNAPAS® 8118 E | 4 °C[1] 39.2 °F[1] |
VINNAPAS® 8620 E | 5 °C[1] 41.0 °F[1] |
VINNAPAS® 8819 E (Scale-up Product) | 4 °C[1] 39.2 °F[1] |
[1] Mindesttemperatur Filmbildung | DIN ISO 2115