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Drywall

Drywalling with gypsum boards is on the rise. VINNAPAS® polymer binders enhance the quality of gypsum-based joint fillers, putties and troweling compounds. They provide enhanced adhesion to the substrate, and improve workability and cracking resistance.

VINNAPAS® VAE T polymer powders enable joint fillers (including gypsum-based grades) to be used on a wide range of substrates, while at the same time maintaining excellent workability and adhesive properties. VINNAPAS® H polymer powders make cement-based products water repellent, thus protecting the substrate and improving durability.

Benefits

  • Enhanced adhesion
  • Increased cohesion
  • Flexibility of joint fillers and prevention of cracking
  • Suitable for different substrates
  • Improved workability
  • Improved low-temperature performance

Applications

  • Gypsum plasterboards
  • Floors
  • Walls
  • Ceilings
  • Cement fiberboards

产品推荐

表格可上下滚动
个产品
技术数据
固体含量 动力粘度 玻璃化温度
VINNAPAS® 510 ED 54 - 56 % 54 - 56 % 1500 - 2500 mPa·s 1500 - 2500 mPa·s approx. 19 °C[1] approx. 66.2 °F[1]
VINNAPAS® 550 ED - - 100 - 400 mPa·s 100 - 400 mPa·s approx. -5 °C[1] approx. 23.0 °F[1]
说明
[1] 玻璃化温度 | 专用方法,  [] 适合,  [] 非常适合,  [] 极其适合 

Benefits

  • Adhesion to different substrates
  • Flexibility, e.g. for greater elongation or crack-bridging
  • Workability, e.g. smooth and easy to apply, longer open time
  • Durability, e.g. high color stability

Applications:

  • Patch and repair

Product Recommendations

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