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Electronics

Room-temperature vulcanizing silicone elastomers from WACKER reliably protect against external influences, which ensures the functional safety of electrical and electronic components. As one of the world’s leading silicone manufacturers with many years of experience, WACKER is a competent partner of the industry and offers tailor-made solutions for potting, bonding, sealing and coating.

Main Properties:

  • For applications in closed housings
  • Low modulus of elasticity (10 – 100 kPa)
  • Damping of thermomechanical stress
  • Broad range of application temperatures (-45 to +180 °C)
  • Superior reliability
  • Low ion levels
  • Low bleeding
  • Tailor-made processing properties for fast mass production
  • Room-temperature or heat curing (one-component)
  • Self-leveling and thixotropic gels
  • Adhesion to various substrates due to inherent tack

Soft Gel Applications:

  • Sensitive electronic components
  • ECUs
  • Power modules
  • Discrete devices (glob tops)
  • Sensors
  • Displays
  • Bonded ICs

Tough Gel Applications:

  • Voltage regulators
  • Transformer potting
  • Coil potting
  • Junction boxes for PV applications

Product Recommendations

Table is scrollable
Products
Technical data
Product properties
Viscosity, dynamic Pot life Penetration Regulation Crosslinking Property Vulcanizate
ELASTOSIL® CAT UV 1000 mPa·s[1] 1000 mPa·s[1] ≥ 1 d[10] ≥ 1 d[10] - - - - -
ELASTOSIL® RT 7331 TC A/B US 20000 mPa·s[2] 20000 mPa·s[2] - - - - - - -
ELASTOSIL® RT 745 "S" A/B 1000 mPa·s[3] 1000 mPa·s[3] - - - - - - -
ELASTOSIL® RT 745 T A/B 1000 mPa·s[4] 1000 mPa·s[4] - - - - - - -
ELASTOSIL® RT 745 T A/B KR 1000 mPa·s[4] 1000 mPa·s[4] - - - - - - -
ELASTOSIL® RT 745 T A/B KR 1000 mPa·s[4] 1000 mPa·s[4] - - - - - - -
ELASTOSIL® SOLAR 2202 FC A/B - - - - - - - - -
SEMICOSIL® 911 A/B 8000 mPa·s[5] 8000 mPa·s[5] - - - - Low volatile Two-component, Addition Curing low ion content
SEMICOSIL® 9242 20000 mPa·s[6] 20000 mPa·s[6] - - - - - - -
SEMICOSIL® 936 UV 8000 cP[7] 8000 cP[7] - - - - - - -
SEMICOSIL® 950 UV B 1000 mPa·s[8] 1000 mPa·s[8] - - - - - - -
WACKER SilGel® 351 A/B 1000 mPa·s[9] 1000 mPa·s[9] - - - - - - -
WACKER SilGel® 612 A/B 1000 mPa·s[1] 1000 mPa·s[1] - - 300 1/10mm[11] 300 1/10mm[11] - - -
WACKER SilGel® 613 - - - - 70 1/10mm[12] 70 1/10mm[12] - - -
WACKER SilGel® 616 A/B 300 mPa·s[1] 300 mPa·s[1] - - 280.0 1/10mm[13] 280.0 1/10mm[13] - - -
WACKER SilGel® 631 A/B 20 - 35 cP[3] 20 - 35 cP[3] - - 35[14] 35[14] - - -
Legend
[1] Viscosity, dynamic | 25 °C | ISO 3219,  [2] Viscosity, dynamic | 1 1/s | DIN EN ISO 3219,  [3] Viscosity, dynamic | 23 °C | ISO 3219,  [4] Viscosity, dynamic | ISO 3219,  [5] Viscosity A [D=0,5 s⁻¹] | 25 °C | DIN EN ISO 3219,  [6] Viscosity, D=0.5 1/s | 25 °C | ISO 3219,  [7] Viscosity, dynamic | 23 °C ,  [8] Viscosity, dynamic | DIN EN ISO 3219 | A: SEMICOSIL® 949 UV A; B: SEMICOSIL® 950 UV B,  [9] Viscosity, dynamic | 23 °C | WSTM 3342,  [10] Pot life | Typical Value for 25°C for which doubling of mix viscosity in static mixing tube is referred to, [not exposed to UV light or ambient light, depending on addition curing silicone grade]; No processing with premix recommended,  [11] Penetration | DIN ISO 2137 | 150 g hollow cone, 1 min.,  [12] Penetration (hollow cone, 9.38 g) | DIN ISO 2137,  [13] Penetration | DIN ISO 2137 | 150 g hollow cone, 60 sec.,  [14] Penetration | DIN ISO 2137,  [] Suited,  [] Well suited,  [] Ideally suited 

Benefits:

  • Soft gels (encapsulation)
  • Low and high temperature grades
  • Elastic adhesives
  • Efficient mass production processes using fast heat-curing adhesives at moderate temperatures
  • Thermally conductive gap fillers, adhesives, pastes and encapsulants (0.5 – 4 W/mK)
  • Low-temperature grades allow applications down to -45 °C and high-temperature grades up to +210 °C

Applications:

  • Sealing of electronic control units and housings
  • Protection of electronic components by potting or encapsulating
  • Bonding of hybrid PCBs
  • Sealing/bonding of housing components (CIPG, FIPG and preformed gaskets)
  • Coating or bonding of individual elements (e.g. MEMS)
  • Thermal management solutions such as bonding to heat sinks, encapsulants and gap fillers

Benefits:

  • Excellent resistance at temperatures ranging from -50 °C to +180 °C; for special types, from -110 °C +220 °C
  • Very good adhesion to a wide variety of substrates
  • Excellent weathering and UV resistance
  • Outstanding dielectric properties that barely change over a wide temperature and frequency range
  • No corrosive components
  • Excellent environmental compatibility
  • Water-repellent and low moisture absorption
  • Excellent vibration damping
  • High chemical purity

Applications:

  • Coating and encapsulation of sensitive components (measuring instruments, system control)
  • Coating of selected areas of a component
  • Sealing of sensor elements
  • Sealing of housing components
  • Sealing of MEMS microphones and speakers
  • Corrosion protection, pressure compensation and vibration damping for electromechanical sensor elements

Product Recommendations

Table is scrollable
Products
Technical data
Product properties
Viscosity, dynamic Hardness Shore A Tensile strength Elongation at break Tear strength Pot life Penetration Regulation Product Rheology Crosslinking Property Vulcanizate
ELASTOSIL® CAT UV 1000 mPa·s[1] 1000 mPa·s[1] - - - - - - - - ≥ 1 d[10] ≥ 1 d[10] - - - - - -
ELASTOSIL® N 2010 10.000 mPa·s[2] 10.000 mPa·s[2] 25[11] 25[11] 1 N/mm²[14] 1 N/mm²[14] 200 %[18] 200 %[18] - - - - - - - Shear thinning, Self-levelling - -
ELASTOSIL® N 2034 30000 mPa·s[3] 30000 mPa·s[3] 35[11] 35[11] 2 N/mm²[14] 2 N/mm²[14] 200 %[18] 200 %[18] - - - - - - Flame retardant - - -
ELASTOSIL® N 2199 950000 mPa·s[4] 950000 mPa·s[4] 30[11] 30[11] 2.5 N/mm²[14] 2.5 N/mm²[14] 400 %[18] 400 %[18] 6.5 N/mm[23] 6.5 N/mm[23] - - - - MIL-A 46106 grade Non-slump - -
ELASTOSIL® N9111 GREY 1000000 mPa·s[3] 1000000 mPa·s[3] 30[11] 30[11] 2.2 N/mm²[14] 2.2 N/mm²[14] 500 %[19] 500 %[19] 10 N/mm[24] 10 N/mm[24] - - - - - Non-slump, Thixotropic - -
ELASTOSIL® N9111 WHITE 900000 mPa·s[4] 900000 mPa·s[4] 30[11] 30[11] 2.20 N/mm²[14] 2.20 N/mm²[14] 500 %[19] 500 %[19] 10 N/mm[24] 10 N/mm[24] - - - - Flame retardant Non-slump, Thixotropic - -
ELASTOSIL® RT 601 A/B 5000 mPa·s[5] 5000 mPa·s[5] 45[11] 45[11] 6 N/mm²[15] 6 N/mm²[15] 100 %[20] 100 %[20] - - - - - - - Flowable Two-component, Addition Curing Highly transparent
ELASTOSIL® RT 713 - - - - - - - - - - - - - - - Non-slump Fast curing under heat, One-component, Addition Curing Foam, Compressible
ELASTOSIL® RT 745 "S" A/B 1000 mPa·s[5] 1000 mPa·s[5] - - - - - - - - - - - - - - - -
ELASTOSIL® RT 745 A/B 1000 mPa·s[5] 1000 mPa·s[5] 15[11] 15[11] - - - - - - - - - - - - Two-component, Addition Curing -
SEMICOSIL® 9242 20000 mPa·s[6] 20000 mPa·s[6] - - - - - - - - - - - - - - - -
SEMICOSIL® 950 UV B 1000 mPa·s[7] 1000 mPa·s[7] - - - - - - - - - - - - - - - -
SEMICOSIL® 987 GR 350000 mPa·s[8] 350000 mPa·s[8] 50[12] 50[12] 5 N/mm²[16] 5 N/mm²[16] 200 %[21] 200 %[21] - - - - - - - - - -
SEMICOSIL® 988/1K GREY 440000.0 mPa·s[9] 440000.0 mPa·s[9] 35[13] 35[13] 4.5 N/mm²[17] 4.5 N/mm²[17] 350 %[22] 350 %[22] - - - - - - - - - -
WACKER SilGel® 613 - - - - - - - - - - - - 70 1/10mm[25] 70 1/10mm[25] - - - -
Legend
[1] Viscosity, dynamic | 25 °C | ISO 3219,  [2] Viscosity, dynamic | 25 1/s | ISO 3219,  [3] Viscosity, dynamic D = 0.5 1/s | 25 °C | DIN EN ISO 3219,  [4] Viscosity, dynamic D = 0,5 1/s | 25 °C | DIN EN ISO 3219,  [5] Viscosity, dynamic | 23 °C | ISO 3219,  [6] Viscosity, D=0.5 1/s | 25 °C | ISO 3219,  [7] Viscosity, dynamic | DIN EN ISO 3219 | A: SEMICOSIL® 949 UV A; B: SEMICOSIL® 950 UV B,  [8] Viscosity, dynamic (D = 0.5 s⁻¹) | 25 °C | ISO 3219,  [9] Viscosity, dynamic (D = 0.5 sec⁻¹) | 25.0 °C | ISO 3219,  [10] Pot life | Typical Value for 25°C for which doubling of mix viscosity in static mixing tube is referred to, [not exposed to UV light or ambient light, depending on addition curing silicone grade]; No processing with premix recommended,  [11] Hardness Shore A | DIN ISO 48-4,  [12] Hardness Shore A | ASTM D 2240,  [13] Hardness Shore A | ASTM D 2240 | Measured at 23°C; Cured for 30 min at 150°C in a circulating oven,  [14] Tensile strength | ISO 37 | Type 3 / 23°C / 2mm,  [15] Tensile strength | ISO 37 type 1,  [16] Tensile strength | DIN 53504 S2,  [17] Tensile strength | DIN 53504 S2 | measured at 23°C on pressed sheet 165°C/15 min,  [18] Elongation at break | ISO 37,  [19] Elongation at break | ISO 37 | Type 3 / 23°C / 2mm,  [20] Elongation at break | ISO 37 type 1,  [21] Elongation at break | DIN 53504 S2,  [22] Elongation at break | DIN 53504 S2 | measured at 23°C on pressed sheet 165°C/15 min,  [23] Tear strength | ASTM D 624 B,  [24] Tear strength | ASTM D 624 B | 23°C / 2mm,  [25] Penetration (hollow cone, 9.38 g) | DIN ISO 2137,  [] Suited,  [] Well suited,  [] Ideally suited 

Benefits:

  • High reliability – excellent for harsh testing conditions
  • Low shrinkage (< 0.1 %, before/after cure)
  • Mura-free
  • Extremely low modulus (10 kPa – 200 kPa)
  • Superior optical reliability/precision (after aging)
  • Solutions for all relevant industrial application processes (dam & fill, dispensing, slot-die coating, screen printing, stencil printing)
  • Fast processing (UV-active grades)
  • Low elastic modulus – better for one glass solution (OGS), wide temperature range
  • Low dielectric constant (2.7 – 2.8)
  • Easy to rework and cost-saving
  • Broad range of processing parameters
  • No oxygen inhibition
  • No photo-initiators used

Applications:

  • Optical bonding/laminating of touchscreens
  • Encapsulation of optical and electronic components
  • Production of damping elements
  • Large-format displays
  • Displays inside a vehicle

Main Properties:

  • Low-modulus sealing adhesives
  • Very good ability to bond
  • Flowable to non-sag
  • Sealing between cover/lids and housing
  • Pronounced damping properties
  • Broad temperature range (-45°C to +180°C)
  • Damping of thermomechanical stress
  • Maximum reliability and long-term performance
  • Tailor-made properties for efficient and fast production processes

Applications:

  • Electronic components
  • FIPG and CIPG applications
  • Housing and lids made from PBT, PA and aluminum
  • Suitable for automated processes

UV-curing silicones offer UV-induced curing at room temperature thus enabling extremely short cycle times and increased line throughput, resulting in shorter production times and reduced energy costs.

Benefits:

  • High dielectric strength
  • Reliable dielectric insulation
  • Efficient production processes

Applications:

  • Power semiconductors
  • Generators
  • Automotive / e-mobility

Product Recommendations

Table is scrollable
Products
Technical data
Product properties
Viscosity, dynamic Hardness Shore A Tensile strength Elongation at break Tear strength Pot life Penetration Hardness Shore 00 Regulation Crosslinking Property Vulcanizate
ELASTOSIL® CAT UV 1000 mPa·s[1] 1000 mPa·s[1] - - - - - - - - ≥ 1 d[10] ≥ 1 d[10] - - - - - - -
SEMICOSIL® 911 A/B 8000 mPa·s[2] 8000 mPa·s[2] - - - - - - - - - - - - - - Low volatile Two-component, Addition Curing low ion content
SEMICOSIL® 942 UV A/B 3300 mPa·s[2] 3300 mPa·s[2] - - - - - - - - - - - - - - - - -
SEMICOSIL® 949 UV A 150.0 mPa·s[3] 150.0 mPa·s[3] - - - - - - - - - - - - 40[11] 40[11] - - -
SEMICOSIL® 949 UV B 150.0 mPa·s[3] 150.0 mPa·s[3] - - - - - - - - - - - - 40[11] 40[11] - - -
SEMICOSIL® 950 UV B 1000 mPa·s[4] 1000 mPa·s[4] - - - - - - - - - - - - 40.0[12] 40.0[12] - - -
SEMICOSIL® 961 TC A/B 130000 mPa·s[5] 130000 mPa·s[5] - - - - - - - - - - - - 55[13] 55[13] - - -
SEMICOSIL® 986/1K 300000 mPa·s[6] 300000 mPa·s[6] 51[14] 51[14] 5 N/mm²[17] 5 N/mm²[17] 200 %[19] 200 %[19] 8 N/mm[21] 8 N/mm[21] - - - - - - - - -
SEMICOSIL® 988/1K GREY 440000.0 mPa·s[7] 440000.0 mPa·s[7] 35[15] 35[15] 4.5 N/mm²[18] 4.5 N/mm²[18] 350 %[20] 350 %[20] - - - - - - - - - - -
SEMICOSIL® 989/1K 300000 mPa·s[8] 300000 mPa·s[8] 55[14] 55[14] 5 N/mm²[17] 5 N/mm²[17] 200 %[19] 200 %[19] - - - - - - - - - - -
SEMICOSIL® 9981 TC 300 Pa.s[9] 300 Pa.s[9] 80[16] 80[16] - - - - - - - - - - - - - - -
WACKER SilGel® 613 - - - - - - - - - - - - 70 1/10mm[22] 70 1/10mm[22] - - - - -
Legend
[1] Viscosity, dynamic | 25 °C | ISO 3219,  [2] Viscosity A [D=0,5 s⁻¹] | 25 °C | DIN EN ISO 3219,  [3] Viscosity, dynamic | 25.0 °C | DIN EN ISO 3219,  [4] Viscosity, dynamic | DIN EN ISO 3219 | A: SEMICOSIL® 949 UV A; B: SEMICOSIL® 950 UV B,  [5] Viscosity, dynamic Cone-plate-viscosimeter Component A | 23 °C | ISO 3219, D = 10 1/s,  [6] Viscosity, dynamic (D = 0.5 s⁻¹) | 25 °C | ISO 3219,  [7] Viscosity, dynamic (D = 0.5 sec⁻¹) | 25.0 °C | ISO 3219,  [8] Viscosity, dynamic (shear rate = 0,5 s⁻¹) | 25 °C | DIN EN ISO 3219,  [9] Viscosity [D= 0.5 sec⁻¹] | 25 °C | DIN EN ISO 3219,  [10] Pot life | Typical Value for 25°C for which doubling of mix viscosity in static mixing tube is referred to, [not exposed to UV light or ambient light, depending on addition curing silicone grade]; No processing with premix recommended,  [11] Shore 00 | 23 °C | ASTM D 2240 | 10 sec 140 mW/cm² followed by 30 min 150°C,  [12] Hardness Shore 00 | 23 °C | ASTM 2240 / Type 00 | Curing Conditions: 10 sec / 140 mW/cm2 followed by 30 min 150°C; measured@23°C,  [13] Hardness Shore 00 | ASTM D 2240,  [14] Hardness Shore A | ISO 868,  [15] Hardness Shore A | ASTM D 2240 | Measured at 23°C; Cured for 30 min at 150°C in a circulating oven,  [16] Hardness Shore A | DIN 53 505 / ISO 868,  [17] Tensile strength | DIN 53504 S2,  [18] Tensile strength | DIN 53504 S2 | measured at 23°C on pressed sheet 165°C/15 min,  [19] Elongation at break | DIN 53504 S2,  [20] Elongation at break | DIN 53504 S2 | measured at 23°C on pressed sheet 165°C/15 min,  [21] Tear strength | ASTM D 624 B,  [22] Penetration (hollow cone, 9.38 g) | DIN ISO 2137,  [] Suited,  [] Well suited,  [] Ideally suited